Kūʻai wela no Kina ʻO nā paipu wela keleawe ka pā wai hoʻoluʻu wai hoʻoluʻu wai wela no ka CPU wai hoʻoluʻu wai.

ʻO kā mākou pahuhopu ka hōʻike ʻana i nā huahana maikaʻi maikaʻi ma nā kumukūʻai koʻikoʻi, a me nā lawelawe kiʻekiʻe i nā mea kūʻai aku a puni ka honua. Ua hōʻoia ʻia mākou i ka ISO9001, CE, a me GS a pili pono i kā lākou mau kikoʻī maikaʻi loa no ke kūʻai wela no Kina Copper Heat Pipes Water Cooling Plate.Pahu Wela Hooluu Waino ka CPU Water Cooling Block, E hoʻomanaʻo e hāʻawi iā mākou i kāu mau kikoʻī a me nā kikoʻī, a i ʻole e manaʻo maoli ʻole i ke kumu kūʻai e hoʻokaʻaʻike mai iā mākou me nā nīnau a i ʻole nā ​​nīnau āu e loaʻa ai.
ʻO kā mākou pahuhopu ka hōʻike ʻana i nā huahana maikaʻi maikaʻi ma nā kumukūʻai koʻikoʻi, a me nā lawelawe kiʻekiʻe i nā mea kūʻai aku a puni ka honua. Ua hōʻoia mākou i ka ISO9001, CE, a me GS a pili pono i kā lākou mau kikoʻī maikaʻi loa noPapa Hooluu Wai Kina, Pahu Wela Hooluu Wai, I kēia manawa, hoʻolako mākou i nā mea kūʻai aku me kā mākou mau mea nui A ʻo kā mākou ʻoihana ʻaʻole wale ka "kūʻai" a me ka "kūʻai aku", akā e nānā pū i nā mea hou aku. Manaʻo mākou e lilo i mea hoʻolako kūpaʻa a me ka mea hana lōʻihi ma Kina. I kēia manawa, manaʻolana mākou e lilo i mau hoaaloha me ʻoe.

ʻO ka mea hoʻokele kaʻa ʻo Insulated Gate Bipolar Transistor (Insulated Gate Bipolar Transistor, ka IGBT) ka hana hoʻopau wela e lilo i kaʻa IGBT ke komo nei i ka mākeke uila uila, e like me (weld) wela wela, traction inverter, kaʻa kaʻa, a pēlā aku. ka hoʻohui ʻana i ke kūpaʻa wela haʻahaʻa me Vce(on) silika.

ʻO ka IGBT i ka hapanui o nā hihia e hana me ka mana kiʻekiʻe, ʻo ka mana kiʻekiʻe ke kiʻekiʻe o ka wela, ʻo ka IGBT e pili ana i ka mana nui, ke alapine kiʻekiʻe, maʻalahi ke hoʻokele, haʻahaʻa haʻahaʻa, modular, kuhikuhi i ke ala o ka hoʻomohala ʻana, ke hoʻohālikelike ʻia me nā mea uila uila ʻē aʻe, ʻo ka IGBT heat sink he kiʻekiʻe hilinaʻi, maʻalahi ka hoʻokele, maʻalahi e pale, ʻaʻohe buffer circuit a me ka hoʻololi pinepine ʻana he kiʻekiʻe loa, no laila e lilo ka IGBT i ka wela wela. I mea e hoʻokō ai i kēia mau hana kiʻekiʻe, ua hoʻohana ʻia nā kaʻina hana i nā kaʻa i hoʻohui ʻia, e like me ka epitaxy, implantation ion, lithography maikaʻi, a me nā mea ʻē aʻe. No ka loaʻa ʻana o nā mea IGBT i nā hiʻohiʻona maikaʻi o ka diode PIN, ʻaʻole ʻokoʻa loa nā hiʻohiʻona o ka p-channel power IGBT module heat sink mai ka n-channel IGBT, kahi mea kūpono loa i ka hoʻokomo ʻana i kahi hoʻolālā hoʻohui i ka noi, no laila e hoʻonui ai i kāna noi ma ke kahua o ka ʻenehana hoʻokele ac a me ka ʻenehana. ʻO ka pōmaikaʻi nui loa o IGBT ʻo ia ka hiki ke kū i ka haʻalulu o kēia manawa ma kahi mokuʻāina a pōkole paha. ʻAʻole pilikia kona pili like ʻana a ua maʻalahi kona pilina moʻo ma muli o kona lohi pōkole.

Hoʻokomo pinepine ʻia nā ʻano hoʻololi wela IGBT i ka hoʻolili ʻana i ka ea, ka hoʻoluʻu wai, ka wela keleawe a i ʻole ka wela alumini. Hoʻokumu ʻia kona hoʻoheheʻe ʻana i ka wela ma ke kumu kumu o ka hoʻoili wela, ua hoʻolālā ʻia kahi ala kahe wela me ka haʻahaʻa haʻahaʻa haʻahaʻa no ka mea i hiki ke hoʻokuʻu ʻia ka wela i hoʻokuʻu ʻia e ka hāmeʻa i hiki ke hoʻokuʻu ʻia, i mea e hōʻoia ai e mālama mau ʻia ka wela o ka hui kūloko o ka hāmeʻa i loko o ka mahana hui ʻae ʻia.

I kēia manawa, ʻo ka IGBT heat pipe heat sink i loko o ka mākeke e komo pū me ka wela dissipation fin, ka paipu wela a me ka substrate, kahi i hāʻawi ʻia ai ka substrate me nā ʻāpana like ʻole, a laila hoʻopili ʻia ke awāwa me ka solder i ka ʻāpana evaporating o ka paipu wela. I loko o ka ʻenehana wela wela IGBT i kēia manawa, ua kanu ʻia ka ʻāpana evaporating o ka paipu wela i ke awāwa o ka substrate a ʻaʻole kūpono i ka ʻili IGBT. Ma ke kaʻina hana, lawe mua ʻia ka wela mai ka ʻili IGBT ma o ka substrate a laila hoʻoneʻe ʻia i ka paipu wela a me ka wela wela. ʻO ka hope, hoʻololi ʻia ka wela mai ka wela wela i ka lewa ma o ka convection. No ka mea, ʻoi aku ka kiʻekiʻe o ka pāpaʻi ponoʻī, a ʻoi aku ka kiʻekiʻe o ka coefficient thermal conductivity o ka paipu wela ma mua o ke kumu, ua kaupalena ʻia ka hana ʻana o ka wela wela, a ua hoʻemi ʻia ka hana hoʻoheheʻe wela. Hiki i ka IGBT heat sink ke hoʻololi like i ka wela mai ka substrate a hiki i ka fin, hiki ke hoʻopau pono i ka pilikia dissipation wela o ke kahe wela kiʻekiʻe, ʻaʻole wale me ke kiʻekiʻe kiʻekiʻe akā me kahi hoʻolālā paʻa a ʻaʻohe wahi neʻe, hiki ke ʻike maoli i ka mālama ʻole.

Mana Kiekie IGBT Heat Sink Me Friction Welding Technology

Kaʻina Huahana

ʻO kaIGBT wela welaHoʻohana ʻia ke kaʻina hana kuʻi ʻana, nā ʻāpana ʻelua o ka alumini heat sink friction welding hui, i mea e hoʻokō ai i kaIGBT wela welaPono ka pauku keʻa, ʻO ka hope, ua hoʻokumu ʻia ka hoʻolālā ʻano hoʻohui a me ka hana hoʻoheheʻe wela wela ma hope o ka hana ʻana o CNC, hiki i ke kaʻina hana kuʻi ʻana ke hōʻemi i ke kumu kūʻai o ka mold, lōʻihi ka manawa pōkole, paʻa kiʻekiʻe. Ua hoʻomohala ʻo Lori i nā ʻano like ʻolealumini wela welamau mea a hoʻonui mau i ka waihona waihona waiwai maʻamau e hāʻawi i nā mea kūʻai aku i nā hoʻonā hui hou e koho ai. ʻO kaIGBT wela welaʻO ke kaʻina hana penei

IGBT wela me ka paipu wela

Nā kikoʻī huahana

ʻO kēiaIGBT wela me ka paipu welakomo nuipuʻu wela,paipu welaakumu, kahi i hoʻolako ʻia ai ke kumu me nā ʻāpana like like ʻole, a laila e kūʻai ʻia nā ʻāpana me ka solder i ka ʻāpana evaporating o ka paipu wela.

I ka mea e noho neiIGBT wela me ka paipu welaʻenehana, ua kanu ʻia ka ʻāpana evaporating o ka paipu wela i ke kumu kumu, ʻaʻole kūpono i ke kumu o IGBT. I ka wā o ke kaʻina hana IGBT, hoʻopau mua ʻia ka wela ma ka ʻili o ka IGBT ma ke kumu, a laila hoʻoili ʻia ka wela i ka paipu wela a me ka wela wela. ʻO ka hope, ua hoʻoneʻe ʻia ka wela i ka lewa ma o ka convection ma o ka wela wela.

IGBT Heat sink Noi

IGBT Heat Pipe Heat sinkua hoʻohana ʻia i ka LEDLighting, Inverter, Welding Machine, Communication Device, Power Supply Equipment, Electronic Industry, Thermoelectric Coolers/Generator, IGBT/UPS Cooling Systems, etc.

ʻO kā mākou pahuhopu ka hōʻike ʻana i nā huahana maikaʻi maikaʻi ma nā kumukūʻai koʻikoʻi, a me nā lawelawe kiʻekiʻe i nā mea kūʻai aku a puni ka honua. Ua hōʻoia ʻia mākou i ka ISO9001, CE, a me GS a pili pono i kā lākou mau kikoʻī maikaʻi loa no ke kūʻai wela no Kina Copper Heat Pipes Water Cooling Plate.Pahu Wela Hooluu Waino ka CPU Water Cooling Block, E hoʻomanaʻo e hāʻawi iā mākou i kāu mau kikoʻī a me nā kikoʻī, a i ʻole e manaʻo maoli ʻole i ke kumu kūʻai e hoʻokaʻaʻike mai iā mākou me nā nīnau a i ʻole nā ​​nīnau āu e loaʻa ai.
Wela kuai noPapa Hooluu Wai Kina, Water Cooling Heat Sink, I kēia manawa, hoʻolako mākou i nā mea kūʻai aku me kā mākou mau mea nui Aʻo kā mākouʻoihanaʻaʻole wale ka "kūʻai" a me ka "kūʻai aku", akā, e nānā hou aku. Manaʻo mākou e lilo i mea hoʻolako kūpaʻa a me ka mea hana lōʻihi ma Kina. I kēia manawa, manaʻolana mākou e lilo i mau hoaaloha me ʻoe.

Guangxi Ruiqifeng New Material Co., Ltd.

Hoʻohui:Pinggou Industrial Zone.Baise, Guangxi, Kina.

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E like me kā mākou e ʻike ai, ʻaʻole maikaʻi loa ka hoʻokele waiwai i kēia makahiki, a ke piʻi wikiwiki nei nā mea maka, no laila nui nā ʻoihana e kū i ke kaomi o ke kumukūʻai.Eia nō naʻe, aia mākou i ka wahi waiwai o ka bauxite, a loaʻa iā mākou ka alumini wai wai kiʻekiʻe mai ka CHALCO, ʻokoʻa, loaʻa iā mākou ka hale hoʻoheheʻe & hoʻolei ʻana, hale hana mold, hale hana extrusion, a me ka mea kanu hana hohonu.ʻO kēia mau mea maikaʻi a pau, hiki iā mākou ke hāʻawi iā ʻoe i nā kumukūʻai hoʻokūkū ʻoi aku ka maikaʻi, ka lawelawe hoʻokahi a me ka maikaʻi..

Inā ʻaʻole maopopo i ka mea i kūpono iā ʻoe? ʻoluʻolu maie hoʻokaʻaʻike iā Ruiqifeng Technical, a i ʻole pololeikelepona iā mākou ma +86 13556890771, a i ʻole e noi i kahi koho ma oEmail (info@aluminum-artist.com).